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Boundless Connectivity of the Future: 6G-TakeOff Takes Off! A groundbreaking 3D architecture of an organic 6G network is set to connect ground stations, aerial platforms, and satellites, forming a seamless network with flexibility for businesses, private users, and the Internet of Things.

The currently deployed terrestrial systems only offer a two-dimensional radio coverage, leading to inadequate network coverage and capacity. The goal of the 6G-TakeOff research project is therefore to create an innovative unified 3D 6G architecture, encompassing networks from ground stations, aerial platforms, and satellites.
Through experimentational platforms, we aim to demonstrate the feasibility of this new architecture. We place special emphasis on highly flexible and autonomous connections between the various network components. Our objective is to enable efficient network utilization for businesses, private users, and devices such as smartphones on the Internet of Things.
To achieve this, we combine various access technologies to optimize connectivity for different participants in the network. We rely on an organic network behavior that allows dynamic movement of network nodes to seamlessly integrate into or disengage from the network.
Within the scope of 6G-TakeOff, we also employ Artificial Intelligence (AI) to find optimal connections for the generated data streams. AI is also used to enhance network resilience and anticipate disruptions. Novel authentication protocols are developed to enhance privacy and data protection.
At SML, our focus is on defining requirements for 6G core functions, particularly concerning the highly dynamic network structure. We also adapt Multi-Access Edge Computing (MEC) concepts for dynamically changing network components to ensure the optimal distribution of data streams. Our goal is to implement and demonstrate the developed methods in a testbed.

Our partners:

Deutsche Telekom AG
Airbus Defence and Space GmbH
Creonic GmbH
Deutsches Zentrum für Luft- und Raumfahrt e.V.
DSI Aerospace Technologie GmbH
Fraunhofer-Institut FOKUS
IHP-Leibniz Institut für innovative Mikroelektronik
John Deere GmbH & Co. KG
NXP Semiconductors Germany GmbH
OTARIS Interactive Services GmbH
Rohde & Schwarz GmbH & Co. KG
Telefónica Deutschland GmbH & CO OHG
Technische Universität Kaiserslautern
Universität Bremen
Zentrum für Telematik e.V.
ZF Friedrichshafen AG